Pasta térmica SAVIO TG-01, 4,7 W/m·K, 10 g, densidad 2,5 g/cm³, funcionamiento −50–250 °C

SAVIO TG-01 is a black thermal paste with a declared thermal conductivity of 4.7 W/m·K and density 2.5 g/cm³, supplied in a 10 g syringe. The compound fills microscopic cavities between a processor and a heatsink, improving heat transfer and helping to maintain efficient cooling in electronic devices. The packaging and included spatula allow controlled, repeatable application and prevent the paste from drying between uses.

Advantages

SAVIO TG-01 contains carbon microparticles that effectively bridge surface irregularities to provide high thermal conductivity. Its non-metallic composition means the paste is electrically non-conductive, which reduces the risk of short circuits and corrosion on the heatsink base and IHS. The product consistency is balanced for easy spreading, and the syringe plus spatula enable precise dosing and multiple safe uses.

Suitable for

• Thermal interface between CPU and heatsink in desktop and workstation systems
• Thermal contact for GPU coolers and aftermarket cooling solutions
• Cooling assemblies in small-form-factor and custom electronic devices

Key specifications

• Thermal conductivity: 4.7 W/m·K
• Weight: 10 g (0.01 kg)
• Operating temperature range: -50 to 250 °C
• Colour: Black
• Packaging: Syringe with spatula included

How to use

Clean the CPU heatspreader and heatsink contact surface from old thermal compound and contaminants using isopropyl alcohol or a suitable cleaner. Apply a small, pea-sized amount of SAVIO TG-01 in the center of the CPU or use a thin line/dot method depending on the CPU type. Mount the heatsink with even pressure so the paste spreads into a thin, continuous layer. Remove excess with a lint-free cloth if necessary and store the syringe in its original packaging to avoid drying.

Recommendations

For best results, use a minimal amount sufficient to cover contact surfaces after mounting; avoid excessive application which can reduce thermal performance. Ensure surfaces are clean and dry before applying and follow the heatsink manufacturer's mounting sequence and torque specifications.