Almohadilla térmica Thermal Grizzly TG-KS-24-12 — almohadilla térmica 24 mm x 12 mm para electrónica

The Thermal Grizzly TG-KS-24-12 thermal pad is a compact, pre-cut heat transfer interface measuring 24 mm by 12 mm, designed for use between electronic components and heatsinks. It provides improved thermal conductivity compared with air gaps, enabling more consistent heat flow from temperature-sensitive parts such as processors, power regulators and small GPUs to cooling elements. The pad is thin and conformable, filling micro-gaps and uneven surfaces to reduce thermal resistance and help maintain stable operating temperatures in confined or tightly packed assemblies.

Advantages

The thermal pad offers reliable thermal coupling without the mess of pastes and with minimal mechanical stress during installation and removal. Its pre-cut size and flexible material make it easy to position on small components, while its thermal conductivity reduces local hotspots and supports longer component life through improved heat dissipation. The pad is electrically insulating and maintains physical contact under light compression, simplifying retrofits and repairs in consumer and industrial electronics.

Suitable for

• Thermal interface between small CPUs, SoCs and passive heatsinks
• Cooling of power ICs, MOSFETs and voltage regulators on PCBs
• Thermal bridging in compact devices, network equipment and embedded systems
• Replacement or augmentation of worn or missing pads in laptops, consoles and small form-factor PCs

Key specifications

• Material: thermally conductive pad compound
• Dimensions: 24 mm × 12 mm
• Form factor: pre-cut, flexible sheet
• Electrical property: electrically insulating
• Application temperature range: suitable for typical electronic component operating temperatures

How to use

Before applying the pad, power down the device and allow components to cool. Clean the contact surfaces with isopropyl alcohol to remove dust, oils and old thermal materials. Remove the protective liners and place the pad directly onto the component so it covers the intended contact area. Align the heatsink or mating surface and apply even, light pressure to compress the pad and ensure full contact. Reassemble the device and verify proper mechanical fit and thermal performance under normal operating conditions.

Recommendations

Use the pad on flat or slightly uneven surfaces where a moderate gap needs filling; avoid overstretching or folding the material. For high-power applications with large heat flux, consider combining with other cooling measures. Store unused pads in a cool, dry place away from direct sunlight to preserve material properties.