Conector hembra Samsung board-to-board (3710-004285)

Ultra-low-profile board-to-board receptacle with fine pitch and gold-plated contacts for high-density internal connections in compact mobile devices.

Overview

The Samsung 3710-004285 is a board-to-board (BTB) socket designed for internal data and power transfer between printed circuit boards. It features a vertical surface-mount (SMT) receptacle with fine pitch, enabling high-density connections in space-constrained applications. The contact system uses copper alloy with gold plating for reliable signal integrity and durability.

What stands out

• Fine pitch (0.4–0.5 mm) supports high pin counts in minimal board area.
• Ultra-low stack height suits slim mobile device designs.
• Gold-plated contacts ensure low contact resistance and corrosion resistance.
• High-temperature thermoplastic insulator withstands reflow soldering.

Technical details

• Connector type: Board-to-Board (BTB)
• Gender: Receptacle (Socket)
• Mounting type: Surface Mount Technology (SMT)
• Orientation: Vertical
• Pitch: Fine Pitch (0.4–0.5 mm)
• Contact material: Copper Alloy
• Contact plating: Gold
• Insulator material: High-Temperature Thermoplastic (e.g., LCP)
• Current rating: < 1 A per contact
• Voltage rating: < 50 V AC/DC
• Operating temperature: -25°C to +85°C
• Durability: 10–30 mating cycles
• Termination style: Solder
• Application: Internal data and power transfer between PCBs

Our verdict

A service-grade BTB receptacle for Samsung mobile devices, offering reliable fine-pitch connectivity in a compact footprint.