Disipador de CPU Supermicro 1U para zócalo 4677 pasivo SNK-P1046VM

This 1U passive CPU heatsink from Supermicro delivers efficient thermal management for Intel Xeon Scalable processors in space-constrained server environments. Its copper base and heat pipes rapidly transfer heat to dense aluminum fins, relying on system airflow for cooling without any moving parts.

Advantages

Passive cooling eliminates fan noise and failure points, enhancing reliability in data centers. The compact 27.5 mm height fits 1U rackmount chassis, while the copper base and multiple heat pipes ensure excellent heat dissipation for high-TDP CPUs. Screw-down mounting provides secure attachment to LGA 4677 sockets.

Suitable for

• 1U rackmount servers and data center deployments
• Intel Xeon Sapphire Rapids (4th Gen Scalable) processors
• Systems requiring silent, maintenance-free cooling
• High-density computing environments with directed airflow

Key specifications

• Socket compatibility: Intel LGA 4677 (Socket E)
• Cooling method: Passive (requires system airflow)
• Heatsink material: Aluminum fins, copper base, copper heat pipes
• Dimensions: 113 mm (L) x 80 mm (W) x 27.5 mm (H)
• Weight: 0.45 kg
• Mounting mechanism: Screw-down
• Thermal paste: Not included

Recommendations

Pair this heatsink with a high-airflow 1U chassis and ensure proper ducting for optimal cooling of Intel Xeon Scalable processors. Verify TDP requirements against system airflow capacity.