Pasta térmica Prolimatech PK-1 10,2 W/m·K 30 g

Prolimatech PK-1 is a high-performance thermal compound formulated to improve heat transfer between heat-generating components and their cooling solutions. With a thermal conductivity of 10.2 W/m·K and a density of 3.2 g/cm³, this 30 g paste is intended for use where efficient thermal interface materials are required, such as CPUs and GPUs. The paste has a smooth consistency that spreads evenly to fill microscopic surface irregularities, maintaining effective contact between the processor die and the heatsink base.

Advantages

PK-1 offers a combination of high thermal conductivity and stable physical properties that support consistent cooling performance over time. The formula is easy to apply and spreads with minimal effort, reducing the risk of air pockets that degrade thermal transfer. Its composition resists drying and maintains thermal contact through regular operating temperature ranges, making it suitable for sustained workloads and variable ambient conditions.

Suitable for

• Desktop and workstation CPUs requiring efficient thermal transfer
• Discrete GPUs and graphics cooling solutions
• High-performance cooling assemblies including aftermarket heatsinks and water-block interfaces
• System rebuilds, upgrades, and thermal maintenance tasks

Key specifications

• Thermal conductivity: 10.2 W/m·K
• Density: 3.2 g/cm³
• Net weight: 30 g
• Consistency: paste for manual application and spread
• Compatibility: designed for CPU and GPU interfaces and general-purpose thermal joints

How to use

Clean both mating surfaces (processor heatspreader and heatsink base) with isopropyl alcohol and a lint-free cloth to remove old compound and contaminants. Apply a small, pea-sized amount of Prolimatech PK-1 to the center of the processor heatspreader or follow the spread method recommended for your cooler. Mount the heatsink and apply even pressure to spread the compound into a thin, continuous layer; then secure the cooler according to the manufacturer's instructions. Avoid excess application, which can reduce thermal performance.

Recommendations

For best results, reapply thermal compound during major system service or when replacing cooling hardware. Use appropriate safety precautions: avoid contact with skin and eyes, keep out of reach of children, and store in a cool, dry place. When working with integrated circuits, ensure proper grounding to prevent electrostatic discharge.