Pasta térmica SAVIO TG-04 4 g — Conductividad térmica 14,5 W/m·K, temperatura de funcionamiento -250 a 300 °C, gris

Thermal paste with thermal conductivity of 14.5 W/m·K, formulated from carbon and silicone. The grey compound is supplied as a single unit intended for improving heat transfer between electronic components and heatsinks.

Advantages

The thermal compound offers relatively high thermal conductivity for effective heat dissipation. Carbon and silicone composition provides stable thermal contact and easy application. Grey color allows visual confirmation of coverage during installation.

Key specifications

• Thermal conductivity: 14.5 W/m·K
• Ingredients: Carbon, Silicone
• Color: Grey
• Quantity: 1 pc

How to use

Clean both surfaces to be joined, removing old paste and contaminants. Apply a small, even amount of thermal paste to the center of the component, then mount the heatsink and press gently to spread the compound into a thin, uniform layer. Reassemble the device and verify stable contact; avoid excessive paste that can reduce performance.

Recommendations

Use on CPUs, GPUs or other electronic parts requiring improved thermal transfer. Store the product in a cool, dry place and follow manufacturer guidelines for periodic replacement depending on operating conditions.