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SUPERMICRO Disipador 1u Pasivo EPYC7000

SUPERMICRO Disipador 1u Pasivo EPYC7000
SUPERMICRO Disipador 1u Pasivo EPYC7000
56,70 €
The Supermicro SNK-P0062P is a passive heatsink designed to provide reliable thermal management for compatible server processors. Constructed from aluminum with a finned profile, the heatsink transfers heat away from the processor to help maintain steady operating temperatures in compact server and ... Leer más
Stock 1 Código 323448 Marca SUPERMICRO Modelo SNK-P0062P Garantía 2 años

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Entrega estimada Jueves, Octubre 15
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The Supermicro SNK-P0062P is a passive heatsink designed to provide reliable thermal management for compatible server processors. Constructed from aluminum with a finned profile, the heatsink transfers heat away from the processor to help maintain steady operating temperatures in compact server and workstation environments. Its compact footprint and Socket SP3 compatibility make it suitable for systems that require a space-efficient cooling solution without integrated fans.

Advantages

The aluminum construction offers a balance of durability and thermal conductivity while keeping weight low. The compact design supports installation in confined chassis where larger coolers cannot be accommodated. As a fanless heatsink, it reduces moving parts and potential points of failure, contributing to quieter operation and simplified maintenance.

Suitable for

  • Server builds using Socket SP3 processors
  • Workstations with limited internal clearance
  • Environments where passive, low-maintenance cooling is preferred

Key specifications

  • Material: Aluminum
  • Type: Heatsink / Radiator (passive)
  • Fan diameter: 0 mm (no integrated fan)
  • Supported processor sockets: Socket SP3

How to use

Align the SNK-P0062P heatsink with the processor socket and the motherboard mounting points specified for Socket SP3. Apply an appropriate, thin layer of thermal interface material on the processor heat spreader before seating the heatsink. Secure the heatsink using the server or motherboard retention mechanism designed for the form factor; ensure even pressure to maintain good thermal contact. Verify that surrounding components do not obstruct airflow through the system chassis, since the heatsink relies on case airflow for heat removal.

Recommendations

Use this heatsink in systems with adequate chassis airflow and regular dust maintenance. Combine with compatible case fans or system ventilation to improve heat dissipation when operating under sustained load.

Aspectos destacados
  • Server builds using Socket SP3 processors
  • Workstations with limited internal clearance
  • Environments where passive, low-maintenance cooling is preferred
  • Material: Aluminum
  • Type: Heatsink / Radiator (passive)
  • Fan diameter: 0 mm (no integrated fan)
  • Supported processor sockets: Socket SP3
Especificaciones
Código del Sistema Armonizado (HS)
84733080
Diámetro del ventilador
0 mm
Dimensiones del disipador (An x P x Al)
78.6 x 119 x 25
Serie de procesadores compatible
AMD EPYC
Tipo
Heatsink/Radiatior
Ubicación adecuada
Processor
Zócalos de procesador compatibles
Socket SP3
Historial de precios de los últimos 6 meses
SUPERMICRO Disipador 1u Pasivo EPYC7000
Actual
56,70 €
Mínimo
55,97 €
Máximo
68,96 €
Variación 24 h
+0,68 €   +1%
Semana
-0,03 €   0%
Mes
-0,69 €   -1%

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