Alphacool Apex 2 Pasta térmica 2g - 17 W/mK, no conductora, alto rendimiento 14755

Overclockers and system builders pushing their CPUs and GPUs to the limit need a thermal interface that can keep up. The Alphacool Apex 2 Thermal Paste delivers exceptional heat transfer with a thermal conductivity of 17 W/mK, ensuring your high-performance components stay cool under load. The 2g syringe contains a grey, non-curing paste that's easy to apply and spreads evenly for optimal contact between your processor and heatsink.

Key specifications

• Thermal conductivity: 17 W/mK
• Net content: 2g
• Density: 2.7 g/cm³
• Viscosity: 130-180 Pa·s
• Operating temperature range: -30°C to 180°C
• Electrically non-conductive
• Colour: Grey
• Application method: Syringe
• Non-curing and non-corrosive
• Silicone-free
• RoHS and REACH compliant

Why choose it

The Apex 2 stands out with its high thermal conductivity rating, placing it in the high-performance category for thermal pastes. Its non-conductive nature eliminates the risk of short circuits if excess paste contacts nearby components, making it safe for even novice builders. The paste's stable viscosity ensures it won't run or drip after application, maintaining a consistent layer for long-term reliability. Plus, it's silicone-free, preventing any potential contamination of sensitive surfaces.

Ideal use cases

• High-end gaming PCs and workstations
• Overclocked CPUs and GPUs
• Replacement of stock thermal paste on graphics cards
• Cooling solutions for chipsets and other integrated circuits
• Any build where maximum thermal transfer is critical

Good to know

The syringe applicator allows precise control over the amount of paste dispensed, reducing waste and ensuring a clean installation. With a wide operating temperature range from -30°C to 180°C, the Apex 2 remains effective even in extreme conditions, from sub-zero overclocking to high-temperature server environments. Its non-curing formula means it stays pliable and easy to remove during maintenance, without hardening or bonding components together.