Pasta térmica NATEC Husky NPT-1324, conductividad térmica 4,63 W/m·K, volumen 2 ml, densidad 2,5 g/cm³

NATEC Husky thermal paste provides high thermal conductivity of 4.63 W/m·K and low thermal resistance to ensure efficient heat transfer between components. The compound is electrically non-conductive, non-corrosive and requires no curing time — it reaches optimal performance after the first thermal cycle. Supplied in a 4 g syringe with a grey finish, it is intended for use in CPU and GPU cooling assemblies and other electronics where reliable thermal interface material is needed.

Advantages

NATEC Husky combines a high thermal conductivity value with a wide operating temperature range from -30 to 280 °C. The paste is non-conductive electrically and non-corrosive, eliminating the risk of short circuits or contact damage. No curing time is required, so optimal thermal transfer is achieved immediately after installation. The syringe dispenser enables precise and repeated application.

Suitable for

• Thermal interface between CPU and cooler
• Thermal interface between GPU and heatsink
• Cooling installations in desktop PCs and workstations
• Other electronic components requiring thermal management

Key specifications

• Brand: NATEC
• Model: Husky (NPT-1324)
• Thermal conductivity: 4.63 W/m·K
• Weight / Volume: 4 g (0.004 kg)
• Operating temperature: -30 — 280 °C
• Colour: Grey
• Electrical conductivity: Non-conductive

How to use

Clean both mating surfaces from old paste, dust and grease before application. Apply a small, even amount of NATEC Husky thermal paste to the centre of the processor or component surface, then mount the cooler or heatsink and secure it according to the manufacturer's instructions so the paste spreads evenly. If necessary, remove excess paste from the edges with a lint-free cloth and isopropyl alcohol.

Recommendations

Store the syringe at room temperature away from direct sunlight. Use within a reasonable time after opening to avoid contamination. For optimal results, ensure mounting pressure and even contact between surfaces; replace the thermal paste when removing the cooler or during major system maintenance.