Solución de refrigeración FUJITSU S26361-F4051-L831 para segunda CPU, peso 1,04 kg

Replacement cooling solution FUJITSU S26361-F4051-L831 for second CPU, weight 1.04 kg is a dedicated thermal module designed to remove heat from an additional processor in compatible servers or workstations. The unit provides targeted cooling for a secondary CPU position, supporting stable operating temperatures and continuous performance under sustained computational load. The compact assembly is intended for systems that require a separate cooling assembly for a second processor and is compatible with Fujitsu platform designs that accept this form factor.

Advantages

This cooling solution offers focused heat dissipation for a second CPU, helping to prevent thermal throttling and maintain processing throughput. Its design balances thermal performance with a moderate weight of 1.04 kg, enabling straightforward handling during installation. As a replacement module, it restores original cooling characteristics in systems that use a separate second-CPU cooler without requiring system redesign. The unit integrates with existing airflow paths in compatible chassis to support reliable long-term operation.

Suitable for

• Servers or workstations requiring a dedicated cooler for a second processor
• System repairs or maintenance where the original second-CPU cooler is damaged or missing
• Upgrades that add a second CPU to a compatible motherboard or chassis
• Environments with sustained CPU load where consistent thermal control is needed

Key specifications

• Function: replacement cooling module for a second CPU
• Intended installation: dedicated second-CPU position in compatible systems
• Weight: 1.04 kg
• Cooling type: passive/active assembly depending on system integration (requires system fan/airflow)
• Form factor: compact module designed for Fujitsu-compatible server/workstation layouts

How to use

Power down the system and disconnect it from mains power before starting installation. Access the server or workstation interior according to the manufacturer’s service instructions, remove the failed or existing second-CPU cooling assembly if present, and prepare the CPU surface by cleaning old thermal interface material. Apply appropriate thermal interface material compatible with the CPU, align the replacement cooling module with the second-CPU mounting points, and secure it following the chassis or motherboard guidance. Reconnect any required fan headers or connectors that integrate the module with system cooling. After reassembly, power on the system and verify BIOS/OS temperature readings to confirm proper operation.

Recommendations

Use compatible thermal paste and follow Fujitsu service documentation for torque specifications and connector seating. Verify that chassis airflow and system fan settings are adequate for two-CPU configurations, and monitor temperatures after installation, especially under peak load, to ensure the replacement cooling solution performs as expected.