Akasa AK 460 Pasta térmica para disipador de CPU

The Akasa AK 460 is a high-quality thermal paste designed for efficient heat transfer between processors and heatsinks. With a thermal conductivity of 2.4 W/mK, it ensures optimal cooling performance for CPUs, GPUs, chipsets, and other electronic components. This silicone-based compound is non-electrical conductive and non-corrosive, making it safe for use on sensitive electronics. The easy-to-apply syringe format allows for precise application, and the non-curing formula ensures easy removal when needed.

Advantages

Reliable thermal interface material that improves heat dissipation, prolongs component life, and maintains system stability. Its non-curing nature means it remains workable over time, and the easy removal simplifies reapplication or cleaning.

Suitable for

• CPU and GPU coolers
• Chipsets and heatsinks
• Any electronic component requiring thermal management

Key specifications

• Thermal Conductivity: 2.4 W/mK
• Net Weight: 1.5 g
• Color: Grey
• Density: 2.5 g/cm³
• Operating Temperature Range: -50°C to 240°C
• Electrical Conductivity: Non-electrical conductive
• Corrosivity: Non-corrosive
• Composition: Silicone-based, Metal Oxide
• Application Method: Syringe
• RoHS Compliance: Yes
• Curing: Non-curing
• Ease of Application: Easy
• Removal: Easy

Recommendations

For best results, clean the CPU and heatsink surfaces thoroughly before application. Apply a small pea-sized amount to the center of the CPU and let the heatsink spread it evenly. Ideal for DIY builders and professionals alike.