Akasa Pasta térmica Premium de alta fiabilidad y rendimiento no dependiente de la presión 3g

The Akasa Premium Hi-Reliability and Performance Non-Pressure Dependent Thermal Compound is a high-quality silicone-based thermal paste designed for optimal heat transfer between CPUs, GPUs, and chipsets and their cooling solutions. With a thermal conductivity of 8.3 W/mK, it ensures efficient heat dissipation, enhancing system stability and longevity. This non-curing, non-corrosive compound is easy to apply via syringe and remains effective over a wide temperature range from -50°C to 250°C.

Advantages

This thermal compound offers reliable performance without pressure dependency, making it suitable for various mounting pressures. Its high viscosity ensures consistent application, while its non-electrical conductive nature provides safety for sensitive components. The compound is RoHS compliant and halogen-free, meeting environmental standards.

Suitable for

• CPU and GPU coolers
• Chipset heatsinks
• Any electronic component requiring efficient thermal management

Key specifications

• Thermal Conductivity: 8.3 W/mK
• Net Content: 3g
• Color: Grey
• Operating Temperature: -50°C to 250°C
• Density: 2.5 g/cm³
• Viscosity: 850,000 cP
• Electrical Conductivity: Non-electrical conductive
• Non-curing: Yes
• Non-corrosive: Yes
• Application Method: Syringe
• Pressure Dependency: Non-pressure dependent
• Recommended Use: CPU, GPU, Chipsets
• Composition Base: Silicone
• RoHS Compliant: Yes
• Halogen Free: Yes
• Dielectric Strength: 5.0 KV/mm
• Thermal Impedance: <0.005 °C-in²/W

Recommendations

For best results, apply a small pea-sized amount to the center of the processor and allow the cooler to spread it evenly. Ensure surfaces are clean before application.