Akasa T6 ProGrade Max pasta térmica 4g

The Akasa T6 ProGrade Max is a high-performance thermal compound designed for efficient heat transfer between CPUs, GPUs, and heatsinks. With a thermal conductivity of 3.6 W/mK and a non-electrical conductive, non-corrosive formula, it ensures safe and reliable operation for demanding applications. The syringe applicator allows precise and easy application, making it ideal for enthusiasts and professionals.

Advantages

Excellent thermal conductivity of 3.6 W/mK ensures optimal heat dissipation. Non-electrical conductive and non-corrosive properties provide safe use on sensitive components. Easy-to-use syringe applicator for precise placement. Wide operating temperature range from -50°C to 240°C.

Suitable for

• CPU and GPU cooling
• Chipset thermal management
• High-performance PC builds
• Laptop and server maintenance

Key specifications

• Thermal Conductivity: 3.6 W/mK
• Net Weight: 1.5 g (4g total package)
• Color: Grey
• Density: 2.3 g/cm³
• Viscosity: 73 Poise
• Operating Temperature: -50°C to 240°C
• Thermal Impedance: <0.008 °C-in²/W
• Dielectric Strength: 5.0 kV/mm
• Application Method: Syringe
• Base Material: Metal Oxide
• RoHS Compliant

Recommendations

For best results, clean the CPU/GPU surface thoroughly before application. Apply a small pea-sized amount and spread evenly. Replace thermal compound every 1-2 years for optimal performance.