Akasa T6 ProGrade+ pasta térmica ProGrade Plus T6 4 gramos

The Akasa T6 ProGrade+ Thermal Compound is a high-performance thermal interface material designed for demanding applications such as CPUs, GPUs, and chipsets. With a thermal conductivity of 6.5 W/mK, it ensures efficient heat transfer, keeping your components cool under load. The 4-gram syringe provides enough compound for multiple applications, and the included spatula aids in precise application.

Advantages

Non-curing and non-bleeding formula ensures long-lasting stability without drying out or leaking. Electrically non-conductive, safe for use on sensitive electronics. RoHS and halogen-free compliant, meeting environmental standards.

Suitable for

• CPU and GPU cooling
• Chipset heat dissipation
• High-performance computing systems

Key specifications

• Thermal Conductivity: 6.5 W/mK
• Weight: 4 g
• Colour: Grey
• Specific Gravity: 2.5 g/cm³
• Viscosity: 85,000 cP
• Operating Temperature Range: -50°C to 250°C
• Electrical Conductivity: No
• Composition: Metal Oxide Based
• Application Method: Syringe
• Non-Curing: Yes
• Non-Bleeding: Yes
• Dielectric Strength: 5.0 kV/mm
• Flammability Rating: UL94 V-0
• Included Accessories: Spatula

Recommendations

For optimal thermal performance, apply a small pea-sized amount to the center of the CPU or GPU before mounting the cooler. Ensure surfaces are clean and free of old thermal compound.